At the Intermountain Conference on Engineering, Technology, and Computing (I-ETC) Conference held at Utah Valley University May 13-14, 2022. Students and Professionals from throughout Utah gathered to learn about current research and the best industry practices for product development, testing, deployment, and operation. The theme for the conference was Innovations & Solutions for Today’s Challenges. Around 100 papers related to this theme were submitted to the conference from undergraduate and graduate students from BYU, UVU, Utah State, U of U, Weber State, and Idaho State. Many of these students also participated in the student research poster competition.
Our very own Madeline Thompson along with Bradley Ferguson, Gregory N. Nielson, Stephen Schultz submitted their paper “Machining of Silicon Carbide Wafers” to the conference. Madeline delivered the presentation of the research on May 14th during the Saturday session of the conference. All papers were peer reviewed by at least two independent reviewers. Based on the quality of the presentation and the paper Madeline received 1st place, the Premium Engineering Paper Award. Congratulations, Mad!